View NSR0340P2T5G_4531897.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

NSR0340P2T5G Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc-dc converter, clamping and protection applications in portable devices. NSR0340P2 in a SOD-923 miniature package enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
Features
http://onsemi.com
* * * * * * * * * * * * * * * * *
Very Low Forward Voltage Drop - 420 mV @ 100 mA Low Reverse Current - 0.6 mA @ 10 V Continuous Forward Current - 200 mA Power Dissipation with Minimum Trace - 190 mW Very High Switching Speed - 3.0 ns @ 10 mA Low Capacitance - 4 pF @ 5.0 V This is a Pb-Free Device LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc-dc Converters Reverse Voltage and Current Protection Clamping & Protection Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS
2
40 V SCHOTTKY BARRIER DIODE
1 CATHODE
2 ANODE
Typical Applications
MARKING DIAGRAM
R 1 1 MG G
SOD-923 CASE 514AB PLASTIC
2
Markets
R = Specific Device Code M = Month Code G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device NSR0340P2T5G Symbol VR IF IFSM ESD Value 40 200 1.0 Class 2 Class A Unit V mA A Package SOD-923 (Pb-Free) Shipping 2 mm Pitch 8000 / Tape & Reel
MAXIMUM RATINGS
Rating Reverse Voltage Forward Current (DC) Non-Repetitive Peak Forward Surge Current ESD Rating: Human Body Model Machine Model
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
(c) Semiconductor Components Industries, LLC, 2008
July, 2008 - Rev. 0
1
Publication Order Number: NSR0340P2/D
NSR0340P2T5G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance Junction-to-Ambient (Note 1) Total Power Dissipation @ TA = 25C Thermal Resistance Junction-to-Ambient (Note 2) Total Power Dissipation @ TA = 25C Junction and Storage Temperature Range Symbol RqJA PD RqJA PD TJ, Tstg Max 520 190 175 570 -55 to +125 Unit C/W mW C/W mW C
1. Mounted onto a 4 in square FR-4 board 10 mm sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Reverse Leakage (VR = 10 V) (VR = 40 V) Forward Voltage (IF = 10 mA) (IF = 100 mA) (IF = 200 mA) Total Capacitance (VR = 5.0 V, f = 1 MHz) Reverse Recovery Time (IF = IR = 10 mA, IR = 1.0 mA) Symbol IR Min Typ 0.6 4.0 290 420 520 4.0 3.0 Max 5.0 20 320 460 560 Unit mA
VF
mV
CT
pF ns
trr
DC Current Source + -
0.1 mF
0V
tr
tp 10%
750 mH 0.1 mF
IF
VR
90%
50 W Output Pulse Generator
Pulse Generator Output IF DUT trr
Adjust for IRM
RL = 50 W Current Transformer 50 W Input Oscilloscope 1. 2. 3. 4. 5. IRM iR(REC) = 1 mA Output Pulse (IF = IRM = 10 mA; measured at iR(REC) = 1 mA)
DC Current Source is adjusted for a Forward Current (IF) of 10 mA. Pulse Generator Output is adjusted for a Peak Reverse Recovery Current IRM of 10 mA. Pulse Generator transition time << trr. IR(REC) is measured at 1 mA. Typically 0.1 X IRM or 0.25 X IRM. tp trr
Figure 1. Recovery Time Equivalent Test Circuit
http://onsemi.com
2
NSR0340P2T5G
1000 IF, FORWARD CURRENT (mA) IR, REVERSE CURRENT (mA) 10000 1000 100 10 1 0.1 0.01 0.001 0.0001 0 5 10 15 20 25 30 35 40 -40C 25C 125C 85C
100
10
125C 25C
1
85C
-40C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 2.
Figure 3.
13 Ct, TOTAL CAPACITANCE (pF) 11 9 7 5 3 1
0
5
10
15
20
25
30
35
40
VR, REVERSE VOLTAGE (V)
Figure 4.
http://onsemi.com
3
NSR0340P2T5G
PACKAGE DIMENSIONS
SOD-923 CASE 514AB-01 ISSUE B
D -X- -Y- E
1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E HE L MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006
b
2X
0.08 (0.0032) X Y A
c
L HE
SOLDERING FOOTPRINT*
0.90 0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
4
NSR0340P2/D

▲Up To Search▲

Price & Availability of NSR0340P2T5G

	To Download NSR0340P2T5G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .